Enhanced coupling with HFSS and Maxwell based on automatic thermal and stress load mapping for multi-physics analysis.
provides the ability to couple thermal and stress simulation to Ansoft\’s industry-leading electromagnetic field simulation software, Maxwell?3D or HFSS? This combination delivers the multidisciplinary analysis framework needed to solve coupled physics problems and allows users to consider thermal, deformation, and mechanical stress consequences of respective electromagnetic field simulations in applicable devices, such as RF components, electromechanical devices, MEMS, and biomedical applications.
product:Ansoft Ephysics 3.1
Lanaguage:english
Platform:Winxp/Win7
Size:174MB