::::::English Description::::::
ANSYS Icechip brings powerful and easy-to-use thermal analysis to Cadence APD and Sigrity UPD (previously Synopsys Encore). Make thermal analysis a seamless part of the design process.
- Simulate all common packaging types — leaded, leadless, BGA, Multi-chip packages, stacked die, system-in-package and multi-chip packages including traces, vias and wire bonds
- Easy and intuitive user interface brings thermal analysis to designers without the need for a specialized background in heat transfer.
- Perform trade studies to optimize the thermal design
- The direct ECAD interface imports every die (even stacked die), trace, via, solderballs, encapsulant and bond wires.
- Import complex geometry like lead frames or heat spreaders from MCAD tools.
- Define non uniform power at the die level to predict hot spots.
- Export the model to ANSYS for stress analysis
- Put the component on a standard JEDEC board and simulate JEDEC thermal tests.
- Fast solve time, typically minute
Product:ANSYS IceChip
Lanaguage:english
Platform:Winxp/Win7
Size:49MB